Ev> Blog> Structural design of semiconductor heat sink corrugated cardboard packaging

Structural design of semiconductor heat sink corrugated cardboard packaging

August 17, 2021


(Text / Xiao Ying Wu Ruomei Huang Yanan Zhuzhou Institute of Technology)

<Packaging Project>
Bizimle iletişime geçin

Author:

Mr. Wayne Tang

Phone/WhatsApp:

+886916140279

Popüler Ürünler
You may also like
Related Categories

Bu tedarikçi için e-posta

Konu:
E-posta:
İleti:

Your message must be betwwen 20-8000 characters

Bizimle iletişime geçin

Author:

Mr. Wayne Tang

Phone/WhatsApp:

+886916140279

Popüler Ürünler

Ev

Product

Whatsapp

Hakkımızda

Sorgulama

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Gönder